| 发明名称 |
CONDUCTIVE STRUCTURE AND MANUFACTURING METHOD THEREFOR |
| 摘要 |
The present specification provides a conductive structure body and a method for manufacturing the same. |
| 申请公布号 |
US2016291712(A1) |
申请公布日期 |
2016.10.06 |
| 申请号 |
US201415035704 |
申请日期 |
2014.11.20 |
| 申请人 |
LG CHEM, LTD. |
发明人 |
LIM Jin Hyong;JANG Song Ho;LEE Ilha;KIM Ki-Hwan;KIM Yong Chan;YOON Junghwan;PARK Chan Hyoung |
| 分类号 |
G06F3/041;H05K1/02;H05K3/22;H05K1/09;H05K3/10;H01L31/0224;H01L31/0216 |
主分类号 |
G06F3/041 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A conductive structure body comprising:
a substrate; a conductive layer provided on the substrate; and a darkening layer provided on at least one surface of the conductive layer, wherein the darkening layer includes a copper nitrate represented by CuxOyNz, and in the copper nitrate, x means an atomic content ratio of Cu, y means an atomic content ratio of O, z means an atomic content ratio of N, and x>0, y>0, z>0, and [y/(x−3z)]<0.1. |
| 地址 |
Yeongdeungpo-gu, Seoul KR |
