| 摘要 |
PURPOSE:To flatten the surface of a laminate after unified molding, by using prepreg for molding a rigid substrate and a flexible substrate in an unified body, as a spacer wherein a part corresponding with a flexible part is punched, and the prepreg corresponding with the punched flexible part is cured. CONSTITUTION:This printed wiring board consists of a rigid part and a flexible part. A flexible substarate 1 and a rigid substrate 4 are subjected to unified molding and outer layer processing while prepreg 3 and a spacer are interposed, thereby obtaining the rigid part. As to the prepreg 3 for bonding the rigid substrate 4 and the flexible substrate 1, a part corresponding with the flexible part is previously punched, and the punched prepreg 3 corresponding with the flexible part is cured. The prepreg 3 is used as the spacer corresponding with the flexible part at the time of molding the rigid substrate 4 and the flexible substrate 1. Thereby a rigid flex printed wiring board wherein the manufacturing cost is low and the outer layer surface after lamination is flat. |
