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发明名称
半导体装置
摘要
本发明提供一种消除形成在半导体基板背面之配线图案映入在输出影像之问题的半导体装置,其系在受光元件1与配线层10之间,形成反射层8,俾使自光透过性基板6透过半导体基板2而射入于配线层10之方向之红外线不会到达配线层10,而会反射至受光元件1侧。反射层8系至少一致地形成在受光元件1之区域下方,或是仅形成在受光元件1之区域下方亦可。又,亦可形成具有将所射入之红外线吸收且防止其透过之功能的反射防止层30,而非形成反射层8。
申请公布号
TW200731520
申请公布日期
2007.08.16
申请号
TW095145296
申请日期
2006.12.06
申请人
三洋电机股份有限公司;三洋半导体股份有限公司
发明人
冈田和央;北川胜彦;野间崇;大塚茂树;山田紘士;石部真三;森田佑一;大久保登;筱木裕之;冲川满
分类号
H01L27/14(2006.01)
主分类号
H01L27/14(2006.01)
代理机构
代理人
洪武雄;陈昭诚
主权项
地址
日本
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