LAMINATING APPARATUS AND METHOD OF PRINTED CIRCUIT BOARD

摘要

An apparatus and a method for laminating a printed circuit board are provided to improve a laminating correctness and productivity by efficiently improving an examining process of a laminating position and a loading position of a coverlay film. An apparatus for laminating a printed circuit board includes an absorbing unit(10), a first vision unit(20), a transfer unit(30), an attaching unit, a separation jig, and a holder(48). The absorbing unit picks up a coverlay film which is cut with a predetermined size. The first vision unit generates a first signal for aligning a position of the coverlay film by photographing the absorbing unit. The transfer unit transfers the absorbing unit to a position of the printed circuit board. The attaching unit drives the absorbing unit for the coverlayer film to be laminated on the printed circuit board. The separation jig is attached to a release film and separates the coverlay film, which is extracted from a supply roller, from the release film. The holder is closed contacted with the separation jig, and is located to be corresponding to a position of the absorbing unit. The separated coverlay film is installed on the holder.