| 摘要 |
In one example, a semiconductor assembly comprises a first IC die (104A), a second IC die (104B), and a bridge module (110). The first IC die includes, on a top side thereof, first interconnects (108A) of a plurality of interconnects (108) and first inter-die contacts (608A) of a plurality of inter-die contacts (608). The second IC die includes, on a top side thereof, second interconnects (108B) of the plurality of interconnects and second inter-die contacts (608B) of the plurality of inter-die contracts. The bridge module is disposed between the first interconnects and the second interconnects and includes bridge interconnects (112) on a top side thereof, the bridge interconnects mechanically and electrically coupled to the plurality of inter-die contacts, and layer(s) of conductive interconnect (706) disposed on the top side thereof to route signals between the first IC and the second IC. A back side (710) of the bridge module does not extend beyond a height of the plurality of interconnects. |
