| 摘要 |
PURPOSE:To improve the initial and durable adhesive property, by nipping a solar cell element in filler sheets of an ethylenic copolymer containing an organic peroxide, placing primed protective materials on both sides of the sheets, and laminating the protective materials on the sheet under heating at a specific temperature or above. CONSTITUTION:A solar cell element, preferably a silicone semiconductor wafer, is nipped in filler sheets, consisting of an ethylenic copolymer, preferably ethylene-vinyl acetate copolymer with ining 20-40wt% vinyl acetate content, containing an organic peroxide, preferably tert-butyl peroxybenzoate having a decomposition temperature of 90-190 deg.C, and the top transparent protective material and the bottom substrate protective material primed with an preferably an organosilane compound of the formula (R1 is epoxy, amino, etc.; R2 is hydrolyzable group) are placed on both sides of the sheets and bonded thereto under heating at the decomposition temperature or above. The priming treatment can also be applied to the surface of the filler sheets. |
