发明名称 Method to detect wafer arcing in semiconductor manufacturing equipment
摘要 Methods and systems for accurate arc detection in semiconductor manufacturing tools are disclosed. Such methods and systems provide real-time arc detection and near real-time notification for corrective actions during a semiconductor manufacturing process. Such methods and systems utilize data with high sample rate and wavelet analysis to provide for more accurate arc detection, which leads to more effective and cost efficient semiconductor manufacturing operations.
申请公布号 US9508612(B2) 申请公布日期 2016.11.29
申请号 US201213687754 申请日期 2012.11.28
申请人 Applied Materials, Inc. 发明人 Singlevich Scott;Subrahmanyam Kommisetti;Davis Tony;Johnson Michael
分类号 H01J37/32;H01L21/66;G01R31/08;G06F17/00 主分类号 H01J37/32
代理机构 Kilpatrick Townsend & Stockton LLP 代理人 Kilpatrick Townsend & Stockton LLP
主权项 1. A method comprising: sampling, by a sensor, data of an electrical parameter associated with an arc event within a semiconductor processing chamber during a semiconductor process; filtering, using discrete wavelet transforms over time for different time windows and frequency bands, the sampled data to generate a time domain arc signal; selecting a predetermined alarm value as a time domain spike threshold for the electrical parameter; comparing the time domain arc signal with the predetermined alarm value; determining whether an arc event occurred based on the comparing; and halting the semiconductor process if it is determined that the arc event occurred.
地址 Santa Clara CA US