| 摘要 |
A chemical mechanical polishing (CMP) composition comprising (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) a glycoside of the formulae 1 to 6 wherein R1 is alkyl, aryl, or alkylaryl, R2 is H, X1, X2, X3, X4, X5, X6, alkyl, aryl, or alkylaryl, R3 is H, X1, X2, X3, X4, X5, X6, alkyl, aryl, or alkylaryl, R4 is H, X1, X2, X3, X4, X5, X6, alkyl, aryl, or alkylaryl, R5 is H, X1, X2, X3, X4, X5, X6, alkyl, aryl, or alkylaryl, and the total number of monosaccharide units (X1, X2, X3, X4, X5, or X6) in the glycoside is in the range of from 1 to 20, and (C) an aqueous medium. |
| 主权项 |
1. A chemical mechanical polishing (CMP) composition comprising
(A) particles selected from the group consisting of ceria and composite particles comprising ceria, (B) a glycoside of formulae 1 to 6: wherein R1 is an alkyl, aryl, or alkylaryl group,
X1, X2, X3, X4, X5, and X6 are structural units as indicated in the rectangles in the formulae 1 to 6,R2, R3, R4, and R5 each are independently H, X1, X2, X3, X4, X5, X6, an alkyl group, an aryl group, or an alkylaryl group,anda total number of monosaccharide units represented by X1, X2, X3, X4, X5, or X6 in the glycoside is from 1 to 20, and (C) an aqueous medium. |
