| 摘要 |
PURPOSE: A semiconductor package and a fabricating method thereof are provided to reduce a size of a package to a chip by adhering a plurality of sidewall leads on both sidewalls of a substrate. CONSTITUTION: A metal pad(15a) is formed on a semiconductor chip(15). The semiconductor chip is adhered on a die pad(11). Both sidewalls of the die pad have respectively a tapering structure which is reduced from a lower part to an upper part. A plurality of sidewall leads(13a,13b,13c) are adhered alternately on the sidewalls of the die pad. The sidewall leads increase gradually in their heights to form a stepped part. A wire(16) is used for connecting the metal pad to the sidewall leads.
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