| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which improves reliability and is thin and easy to test, a carrier package and a multilayer package.SOLUTION: A microelectronic unit 10 comprises a carrier structure 30 including: a front face 31; a rear face 32 that is separated from the front face; an opening on the front face of the carrier structure; and a recess 40 including an inner face 41 that is positioned at a lower side of the front face. The microelectronic unit also comprises a microelectronic element 20 including: a bottom face 22 that is neighboring to the inner face; a top face 21 that is separated from the bottom face; and a plurality of conductive contacts 23 on the top face. The microelectronic unit further comprises a terminal 24 that is electrically connected to the conductive contacts of the microelectronic element, and comprises a dielectric region 70 in contact with at least the top face of the microelectronic element. The dielectric region may include a plane on the same plane as the front face of the carrier structure or at an upper side of the plane. The terminal is exposed on a principal surface 71 in the dielectric region for interconnecting with an external element.SELECTED DRAWING: Figure 1A |
