| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition having excellent heat resistance and dielectric property of a cured article, the cured article thereof, and a semiconductor encapsulation material, a prepreg, a circuit board and a build-up film having these performances.SOLUTION: There is provided a curable resin composition containing a cyanate ester resin (A) having a resin structure represented by the formula (I), a curing accelerator (B), and an epoxy resin (C) as essential components.SELECTED DRAWING: None |
