发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM
摘要 There is provided a method of manufacturing a semiconductor device, comprising forming a film on a substrate by performing a cycle a predetermined number of times, the cycle including non- simultaneously performing forming a first layer by supplying a precursor containing hydrogen and an halogen element to the substrate in a process chamber, under a condition in which the precursor is pyrolyzed if the precursor exists alone and under a condition in which a flow rate of the precursor supplied into the process chamber is larger than a flow rate of the precursor exhausted from an interior of the process chamber and forming a second layer by supplying a reactant to the substrate in the process chamber thereby modifying the first layer.
申请公布号 US2016358767(A1) 申请公布日期 2016.12.08
申请号 US201615170352 申请日期 2016.06.01
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 NITTA Takafumi;SHIMAMOTO Satoshi;HIROSE Yoshiro
分类号 H01L21/02;C23C16/40;C23C16/509;C23C16/455;H01J37/32;C23C16/52;C23C16/44 主分类号 H01L21/02
代理机构 代理人
主权项 1. A method of manufacturing a semiconductor device, comprising: forming a film on a substrate by performing a cycle a predetermined number of times, the cycle including non-simultaneously performing: forming a first layer by supplying a precursor containing hydrogen and an halogen element to the substrate in a process chamber, under a condition in which the precursor is pyrolyzed if the precursor exists alone and under a condition in which a flow rate of the precursor supplied into the process chamber is larger than a flow rate of the precursor exhausted from an interior of the process chamber; andforming a second layer by supplying a reactant to the substrate in the process chamber thereby modifying the first layer.
地址 Tokyo JP