发明名称 |
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface. |
申请公布号 |
US2016316565(A1) |
申请公布日期 |
2016.10.27 |
申请号 |
US201514695057 |
申请日期 |
2015.04.24 |
申请人 |
Unimicron Technology Corp. |
发明人 |
CHEN Yin-Ju;WU Ming-Hao;YU Cheng-Po |
分类号 |
H05K1/18;H05K1/11;H01L35/30;H05K3/30;H05K3/40;H05K1/02;H05K3/46 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Taoyuan TW |