| 摘要 |
PURPOSE: To dispense with a metallic foil film etching process, so as to reduce the manufacturing cost of a printed circuit board by forming the printed circuit board from forming a circuit of a conductive resin on an insulating substrate and plating a metal on the circuit. CONSTITUTION: A circuit is formed of a conductive resin on a substrate by screen-printing a silver paste-like conductive resin 11 prepared by mixing 40-60 pts. silver, 20-40 pts. varnish, 5-20 pts. thinner, and 5-20 pts. baking oil with each other on a substrate 1 made of a thermosetting resin, thermoplastic resin, or ceramic in the form of a circuit and drying and completely curing the resin 11. Then a metallic layer 12 is directly formed only on the circuit by electroless plating a metal. Finally, a printed circuit board is obtained by screen-printing insulating ink 13 on the parts of the circuit other than those carrying the formed metallic layer 12 than contact parts and piercing a hole 15 at a parts inserting position 14. |
