MOLDED RESIN ARTICLE HAVING PLATED LAYER

摘要

PROBLEM TO BE SOLVED: To provide a plated molded resin article having high adhesive strength of the plated layer. SOLUTION: The plated molded resin article is composed of a resin composition containing (A) a polyamide resin having a crystal melting heat of≥10 J/g, (B) a thermoplastic resin excluding the polyamide resin A (excluding a polyphenylene ether resin) and optionally (C) a solubilizing agent and has a metal plated layer formed at least on the surface of the molded resin article having partly eliminated amorphous part of the component A. The molded resin article is not etched with an acid containing chromium and/or manganese. COPYRIGHT: (C)2006,JPO&NCIPI