发明名称 |
METHOD AND COMPOSITION FOR CLEANING WAFERS |
摘要 |
<p>A cleaning solution and method for removing submicron particles from the surface and/or the bevel of an electronic substrate such as a semiconductor wafer. The cleaning solution comprises a polycarboxylate polymer or an ethoxylated polyamine. The method comprises the step of contacting a surface of the substrate with a cleaning solution comprised of a polycarboxylate polymer or an ethoxylated polyamine. Additional optional steps in the method include applying acoustic energy to the cleaning solution and/or rinsing the surface with a rinsing solution with or without the application of acoustic energy to the rinsing solution.</p> |
申请公布号 |
WO2009076201(A1) |
申请公布日期 |
2009.06.18 |
申请号 |
WO2008US85675 |
申请日期 |
2008.12.05 |
申请人 |
FONTANA TECHNOLOGY;BECK, MARK, JONATHAN |
发明人 |
BECK, MARK, JONATHAN |
分类号 |
B08B3/08 |
主分类号 |
B08B3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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