发明名称 |
Hermetic seal cover and manufacturing method thereof |
摘要 |
<p>A hermetic seal cover capable of inhibiting defects such as voids from generating in sealing a package, and a method of manufacturing the seal cover are provided. The hermetic seal cover comprises: a seal cover main body; a Ni plating layer applied onto a surface of the seal cover main body; and a Au-Sn brazing material layer fusion bonded to a surface of the Ni plating layer, and is characterized by a Ni-Sn ally layer disposed between the Ni plating layer and the Au-Sn brazing material layer. It is preferable if the Ni-Sn alloy layer has a thickness of 0.6-5.0µm. It is also preferable if Au-Sn brazing material layer has a Sn content of 20.65-23.5wt%.
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申请公布号 |
EP1610380(A3) |
申请公布日期 |
2007.08.29 |
申请号 |
EP20050253109 |
申请日期 |
2005.05.19 |
申请人 |
TANAKA KIKINZOKU KOGYO KABUSHIKI KAISHA |
发明人 |
MIYAZAKI, KENICHI;KUSAMORI, HIROYUKI |
分类号 |
H01L23/04;H01L21/50;H01L23/10 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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