发明名称 Hermetic seal cover and manufacturing method thereof
摘要 <p>A hermetic seal cover capable of inhibiting defects such as voids from generating in sealing a package, and a method of manufacturing the seal cover are provided. The hermetic seal cover comprises: a seal cover main body; a Ni plating layer applied onto a surface of the seal cover main body; and a Au-Sn brazing material layer fusion bonded to a surface of the Ni plating layer, and is characterized by a Ni-Sn ally layer disposed between the Ni plating layer and the Au-Sn brazing material layer. It is preferable if the Ni-Sn alloy layer has a thickness of 0.6-5.0µm. It is also preferable if Au-Sn brazing material layer has a Sn content of 20.65-23.5wt%. </p>
申请公布号 EP1610380(A3) 申请公布日期 2007.08.29
申请号 EP20050253109 申请日期 2005.05.19
申请人 TANAKA KIKINZOKU KOGYO KABUSHIKI KAISHA 发明人 MIYAZAKI, KENICHI;KUSAMORI, HIROYUKI
分类号 H01L23/04;H01L21/50;H01L23/10 主分类号 H01L23/04
代理机构 代理人
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