APPARATUS FOR TREATING SUBSTRATE

摘要

The present invention relates to a substrate treating apparatus and, more specifically, to a substrate treating apparatus using plasma. According to an embodiment of the present invention, the substrate treating apparatus includes: a chamber having a treatment space therein; a support unit disposed inside the chamber to support a substrate; a gas supply unit supplying a gas into the treatment space; and an antenna unit provided on the upper portion of the chamber, and receiving high frequency power to generate plasma from the gas inside the treatment chamber. The antenna unit can be coupled to the chamber to move in a horizontal direction.