Sequential station tool for wet processing of semiconductor wafers

摘要

Methods and apparatus are provided for processing semiconductor wafers sequentially. Sequential processes employ multi-station processing modules, where particular encompassing wafer processes are divided into sub-processes, each optimized for increasing wafer to wafer uniformity, result quality, and overall wafer throughput. In one example, a copper electroplating module includes separate stations for wetting, initiation, seed layer repair, fill, overburden, reclaim, and rinse.

主权项

1. An apparatus for processing a semiconductor wafer having a recessed feature, the apparatus comprising:
a cluster tool containing a plurality of separate stations; wherein the plurality of separate stations is configured to perform a plurality of distinct processes; and a mechanism for transporting the semiconductor wafer to and from each station of the plurality of separate stations, wherein the plurality of separate stations comprises:
(a) an initiation station configured at least for reducing copper oxide on a copper layer residing on the semiconductor wafer using a reducing gas or a wet reduction chemistry; and(b) an electrofill station configured at least for receiving the wafer after initiation and for filling the recessed feature on the semiconductor wafer with a metal; andwherein the plurality of separate stations are in a stacked format.