| 摘要 |
<P>PROBLEM TO BE SOLVED: To perform thinning by eliminating the substrate thickness of a mounting part for mounting an LED chip and a wire bonding part, and to improve the reflection efficiency of light during lighting. <P>SOLUTION: On the backside of an insulating substrate 1 where a first recessed hole 3a and a second recessed hole 3b are formed, metal (Cu) thin plates 2a and 2b to be wiring patterns corresponding to the respective recessed holes are formed in an electrically separated state. On the surface side of the insulating substrate 1, a metal thin plate 4a to be a first wiring pattern is formed at a part including the first recessed hole 3a, a metal thin plate 4b to be a second wiring pattern is formed at a part including the second recessed hole 3b, the LED chip 5 is mounted on the metal thin plate 4a at the bottom surface part of the first recessed hole 3a, and the LED chip 5 is electrically connected to the metal thin plate 4b at the bottom surface part of the second recessed hole 3b through a metal fine wire 6. In the state, the entire surface of the insulating substrate 1 including the LED chip 5 and the metal fine wire 6 is sealed with a transparent resin 7. <P>COPYRIGHT: (C)2009,JPO&INPIT |
