| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic wiring board which enables the suppression of occurrence of a crack; an electronic component-mounted package.SOLUTION: A ceramic wiring board comprises: a ceramic insulative base 1; and a through-conductor 3 provided to pierce the ceramic insulative base 1 in a thickness direction thereof. The through-conductor 3 has a curved part 3a in the ceramic insulative base 1. On the supposition that a thickness t of the ceramic insulative base 1 makes a whole length, the percentage of a length occupied by the curved part 3a is 50% or more of the whole length. In the through-conductor 3, the curved part 3a slopes; when the through-conductor is projected in the thickness direction of the ceramic wiring board, positions where the through-conductor is exposed from the ceramic insulative base 1 on opposing sides thereof are out of line.SELECTED DRAWING: Figure 1 |
