| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a dual-interface card whose junction reliability is acquired, even in a connection terminal region of a size where the electrical connection of the RF terminal of a dual interface module and the antenna terminal of a card with an antenna built-in is limited. <P>SOLUTION: A pre-solder 81 is formed on an RF terminal 61 of a dual-interface module 60, and a cream solder layer 85 is formed on an antenna terminal 41 of a card 50 with an antenna built-in, and a dual interface module 60a is positioned and mounted on a cavity 55 of a card 50b with an antenna built-in, and the solder junction of the RF terminal 61 and the antenna terminal 41 is carried out, by hot pressing with a press-head 91, and a dual interface card 100 where the dual interface module and the antenna are electrically connected is manufactured. <P>COPYRIGHT: (C)2008,JPO&INPIT |
