发明名称 FLEXIBLE COPPER-CLAD LAMINATED SHEET AND FLEXIBLE CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a flexible copper-clad laminated sheet excellent in flexibility by a simple means using a pair of heat press rolls.SOLUTION: Provided is a method for producing a flexible copper-clad laminated sheet having: a heat bonding step of heat-bonding copper foil (A) and a laminated body (B) such as a polyimide film using a heat press roll; and a reheating step, in which the polyimide layer in the laminated body (B) is made of a plurality of polyimide layers each having a thermoplastic polyimide layer (ii) as an adhesive layer, the laminate temperature T1 of the heat bonding step is higher than the glass transition temperature of the thermoplastic polyimide layer (ii) or more, and, by controlling the heating treatment temperature T2 in the reheating step to T1 or more, the relation between the diffraction intensity (I) of the (200) face obtained by the X-ray diffraction in the thickness direction of the copper foil (A) after the heat bonding step and the diffraction intensity (Io) of the (200) face obtained by the X-ray diffraction of fine powder copper is controlled to I/Io>100.SELECTED DRAWING: None
申请公布号 JP2016215651(A) 申请公布日期 2016.12.22
申请号 JP20160141656 申请日期 2016.07.19
申请人 NIPPON STEEL & SUMIKIN CHEMICAL CO LTD 发明人 MATSUSHITA SUKEYUKI;II SHOICHI
分类号 B32B15/08;B32B27/34;C08G73/10;H05K1/02;H05K1/03;H05K1/09 主分类号 B32B15/08
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