发明名称 |
METHOD FOR MOUNTING AN ELECTRICAL COMPONENT IN WHICH A HOOD IS USED, AND A HOOD THAT IS SUITABLE FOR USE IN THIS METHOD |
摘要 |
A method for mounting an electrical component on a substrate is disclosed. According to the method, joining is simplified using a cover, or hood, that includes a contact structure on an inner side of the hood, wherein when the hood is mounted, the contact structure is joined to the underlying structure at different joining levels simultaneously using an additional material. Moreover, a joining pressure, e.g., for diffusion or sintered bonds for electrical contacts, can be applied using such a hood. |
申请公布号 |
EP3103138(A1) |
申请公布日期 |
2016.12.14 |
申请号 |
EP20150714453 |
申请日期 |
2015.03.30 |
申请人 |
Siemens Aktiengesellschaft |
发明人 |
BUSCHE, Nora;STROGIES, Jörg;WILKE, Klaus |
分类号 |
H01L23/13;H01L21/50;H01L23/00;H01L23/057;H01L23/10;H01L23/473;H01L23/498 |
主分类号 |
H01L23/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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