| 摘要 |
A manufacturing method of a device is provided to uniformly form a cut face of an adhesive film by using a cutting blade having a ring-shaped cutting blade of V type. An adhesive film(3) is mounted on a rear side of a wafer(2). The wafer includes a plurality of devices divided by a division line. An adhesive film side of the wafer is adhered on a surface of a dicing tape. The wafer is cut according to the division line. A cutting groove(210) is formed on the wafer. A cutting blade having a ring-shaped cutting blade of V type is used. The adhesive film is cut according to the cutting groove.
|
