发明名称 |
Cooling system for electronic circuit device. |
摘要 |
A cooling module for an electronic circuit component on a printed circuit board includes a passage in which a coolant flows, a first heat transfer plate exposed to the flow of the coolant, a second heat transfer plate secured to the circuit component, a compliant member between the first and second heat transfer plates for establishing a compliant contact therebetween, and a bellows connected to the first heat transfer plate to elastically press the first heat transfer plate against the circuit component through the compliant member and the second heat transfer plate. |
申请公布号 |
EP0151068(A2) |
申请公布日期 |
1985.08.07 |
申请号 |
EP19850400097 |
申请日期 |
1985.01.22 |
申请人 |
FUJITSU LIMITED |
发明人 |
YAMAMOTO, HARUHICO;SAKAI, MASAAKI;UDAGAWA, YOSHIAKI;KATSUYAMA, KOUJI;NAKATA, MITSUHIKO |
分类号 |
H01L23/473;H01L23/36;H01L23/433;H05K7/20 |
主分类号 |
H01L23/473 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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