发明名称 THERMOSETTING RESIN COMPOSITION
摘要 PURPOSE:To obtain a composition of enhanced various functions, esp. impact resistance, for use in wiring parts, electric and electronic parts, etc., by incorporating thermosetting resin with silicon nitride and a silane-based surface-treating agent for silicon nitride. CONSTITUTION:The objective composition can be obtained by incorporating (A) a thermosetting resin such as epoxy resin, phenolic resin, etc. with (B) 20-75 inner wt% of silicon nitride with a granular size <=100 (pref. <=50)mum, pref. of inexpensive beta-type or low alpha-type (pref. 10-75 inner wt% for higher wear resistance, whereas 10-85 inner wt% for higher impact resistance) and (C) 0.5-3 (pref. 0.7-1) outer wt%, based on the component (B), of a silane-based coupling agent for silicon nitride (e.g., 3-aminopropyl triethoxysilane). The process is pref. as follows: the component(s) (A) and (C) are blended in advance; curing agent, curing accelevator, etc., being then incorporated followed by the component (B).
申请公布号 JPS61272268(A) 申请公布日期 1986.12.02
申请号 JP19850113174 申请日期 1985.05.28
申请人 DENKI KAGAKU KOGYO KK 发明人 NISHIMURA HARUKI;YAMAMOTO MANABU
分类号 C08K3/28;C08K3/00;C08K3/34;C08L101/00 主分类号 C08K3/28
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