发明名称 |
ANISOTROPIC CONDUCTIVE ADHESIVE |
摘要 |
PURPOSE:To stabilize the connection between patterns and improve the reliability of electrical conductivity by specifying the grain size of conductive grains contained in a conductive adhesive. CONSTITUTION:The grain size of conductive grains contained in a conductive adhesive is set to 1-5 times as large as the thickness of a high-resistance layer formed on the surface of the first conductive pattern. The conductive grains are contained at the range of 1-50wt.% in the conductive adhesive. The conductive grains have the specific resistance of 10<-6>OMEGAcm or less, the Vickers hardness of 50 or more, and a rugged grain shape.
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申请公布号 |
JPS63308880(A) |
申请公布日期 |
1988.12.16 |
申请号 |
JP19870145525 |
申请日期 |
1987.06.11 |
申请人 |
SONY CHEM CORP |
发明人 |
FUJIWARA YOSHIO;ANDO TAKASHI;YAMADA YUKIO;KANISAWA SHIKO |
分类号 |
H01R11/01;H05K1/14;H05K3/32 |
主分类号 |
H01R11/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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