发明名称 ANISOTROPIC CONDUCTIVE ADHESIVE
摘要 PURPOSE:To stabilize the connection between patterns and improve the reliability of electrical conductivity by specifying the grain size of conductive grains contained in a conductive adhesive. CONSTITUTION:The grain size of conductive grains contained in a conductive adhesive is set to 1-5 times as large as the thickness of a high-resistance layer formed on the surface of the first conductive pattern. The conductive grains are contained at the range of 1-50wt.% in the conductive adhesive. The conductive grains have the specific resistance of 10<-6>OMEGAcm or less, the Vickers hardness of 50 or more, and a rugged grain shape.
申请公布号 JPS63308880(A) 申请公布日期 1988.12.16
申请号 JP19870145525 申请日期 1987.06.11
申请人 SONY CHEM CORP 发明人 FUJIWARA YOSHIO;ANDO TAKASHI;YAMADA YUKIO;KANISAWA SHIKO
分类号 H01R11/01;H05K1/14;H05K3/32 主分类号 H01R11/01
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