发明名称 MULTILAYER INTERCONNECTION BOARD
摘要 PURPOSE:To enhance the dimensional stability and to reduce the surface roughness by a method wherein an outer-layer sheet is arranged and united on the surface and/or the rear surface of the required number of inner-layer materials via a resin-coated laminated sheet and a prepreg. CONSTITUTION:An outer-layer material is arranged and united on the surface and/or the rear surface of the required number of innerlayer materials via a resin-coated laminated sheet and a prepreg. The resin-coated laminated sheet is obtained by piling up, laminating and shaping the required number of resin- impregnated base materials which are obtained in such a way that a base material of a woven fabric or a nonwoven fabric composed of an inorganic fiber, an organic synthetic fiber or a natural fiber is impregnated with a resin. As the prepreg, a resin-impregnated board to be used as the resin-coated laminated sheet can be used as it is. By this setup, the dimensional stability can be enhanced and the surface roughness can be reduced.
申请公布号 JPH01293695(A) 申请公布日期 1989.11.27
申请号 JP19880126460 申请日期 1988.05.23
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 KOJIMA SHIGEAKI
分类号 H05K3/46 主分类号 H05K3/46
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