摘要 |
PURPOSE:To obtain the manufacturing method of a ceramic multilayered wiring substrate which has a high precision resistance part and a copper circuit wiring part excellent in conducting characteristics which are formed by binary baking, and a solder land part excellent in solder wettabiity. CONSTITUTION:After noble metal paste is printed on the surface of a ceramic multilayered wiring substrate 1, a solder land part 3 is formed by baking in an oxidizing atmosphere. After gold paste and resistance paste are printed, and then a gold pad part 9 and a resistance part 7 are formed by simultaneous or individual baking in an oxidizing atmosphere, copper paste is printed and a circuit wiring part 6 is formed by baking in a non-oxidizing atmosphere. |