| 摘要 |
<p>PURPOSE: To prevent a lead from being damaged due to heater block in wire bonding and a product failure caused by the deformation of the lead, and at the same time to prevent the lead and a lead frame pad from being deformed in sealing resin molding. CONSTITUTION: An adhesive tape 5 is adhered to the site bottom surface of a tip 4a of a lead 4 and chip 1, the lead 4 at a site where no adhesive tape 5 is adhered is bent outward around a support bar 3, and a space part 4b is formed, and an inclination surface and a groove are formed at the four-corner edge part and the edge of a lead frame pad 2 that is supported by the support bar 3.</p> |
