Printed circuit board with warpage prevention layer

摘要

Disclosed herein are a printed circuit board and a method of manufacturing the same. According to an exemplary embodiment of the present invention, the printed circuit board includes: a first insulating layer in which a metal layer is embedded; a warpage prevention layer stacked on the first insulating layer; second insulating layers stacked on both surfaces of the first insulating layer; a via formed on the second insulating layer to be connected to the metal layer; and a solder resist layer stacked on the second insulating layer.

主权项

1. A printed circuit board, comprising:
a first insulating layer; a metal post penetrating the first insulating layer between one surface and another surface of the first insulating layer; a first warpage prevention layer stacked on the one surface of the first insulating layer and having a lower coefficient of thermal expansion than the metal post; a second insulating layer stacked on the one surface of the first insulating layer so as to cover the first warpage prevention layer; a via formed in the second insulating layer and connected to the metal post; and a solder resist layer stacked on the second insulating layer.