| 摘要 |
A flip chip optoelectronic device assembly includes a hollow, cylindrical spacer between an optical source in the substrate and the active surface of the chip, which precludes attenuation of the signal and allows direct transmission through air. An underfill material fills the space between chip and substrate, thereby allowing substrates which are not necessarily matched in thermal expansion to the chips, and the spacer acts as a dam to prevent ingress of underfill material into the optical path. The spacer not only allows use of conventional underfill materials to support the interconnection joints and thermal mismatch, but also defines a fixed "z" axis distance between substrate and chip.
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