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发明名称
METHOD FOR CHIP BONDING
摘要
申请公布号
KR20060020488(A)
申请公布日期
2006.03.06
申请号
KR20040069334
申请日期
2004.08.31
申请人
LG INNOTEC CO., LTD.
发明人
HWANG, SUNG KIL;KU, JA KWON
分类号
H01L21/52
主分类号
H01L21/52
代理机构
代理人
主权项
地址
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