发明名称 |
Systems and methods for semiconductor device process determination using reflectivity measurement |
摘要 |
Methods and systems that include receiving a plurality of reflectivity measurements on a semiconductor wafer. A reflectivity map is generated based on the received plurality of reflectivity measurements. The generated reflectivity map is used to determine a process parameter of an epitaxial growth process using the reflectivity map. In an embodiment, the process parameter is a power setting (heating) of a lamp of a CVD epitaxy tool. |
申请公布号 |
US9482518(B2) |
申请公布日期 |
2016.11.01 |
申请号 |
US201414536298 |
申请日期 |
2014.11.07 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
Tsai Chun Hsiung;Yu Sheng-Wen;Yu De-Wei |
分类号 |
H01L21/00;G01B11/14;G01N21/55;H01L21/66;H01L21/02;H01L21/324 |
主分类号 |
H01L21/00 |
代理机构 |
Haynes and Boone, LLP |
代理人 |
Haynes and Boone, LLP |
主权项 |
1. A method, comprising:
receiving a plurality of reflectivity amounts associated with a semiconductor wafer; determining a spatial distance for a selected reflectivity change using the plurality of reflectivity amounts, wherein the spatial distance defines a distance across the semiconductor wafer within which the selected reflectivity change occurs; generating a reflectivity map based on the plurality of reflectivity measurements; and using the generated reflectivity map to determine a process parameter of an epitaxial growth process. |
地址 |
Hsin-Chu TW |