发明名称 Systems and methods for semiconductor device process determination using reflectivity measurement
摘要 Methods and systems that include receiving a plurality of reflectivity measurements on a semiconductor wafer. A reflectivity map is generated based on the received plurality of reflectivity measurements. The generated reflectivity map is used to determine a process parameter of an epitaxial growth process using the reflectivity map. In an embodiment, the process parameter is a power setting (heating) of a lamp of a CVD epitaxy tool.
申请公布号 US9482518(B2) 申请公布日期 2016.11.01
申请号 US201414536298 申请日期 2014.11.07
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 Tsai Chun Hsiung;Yu Sheng-Wen;Yu De-Wei
分类号 H01L21/00;G01B11/14;G01N21/55;H01L21/66;H01L21/02;H01L21/324 主分类号 H01L21/00
代理机构 Haynes and Boone, LLP 代理人 Haynes and Boone, LLP
主权项 1. A method, comprising: receiving a plurality of reflectivity amounts associated with a semiconductor wafer; determining a spatial distance for a selected reflectivity change using the plurality of reflectivity amounts, wherein the spatial distance defines a distance across the semiconductor wafer within which the selected reflectivity change occurs; generating a reflectivity map based on the plurality of reflectivity measurements; and using the generated reflectivity map to determine a process parameter of an epitaxial growth process.
地址 Hsin-Chu TW