发明名称 LEAD-FREE CONDUCTOR COVERINGS
摘要 Lead-free thermoplastic polyvinyl chloride conductor coverings are disclosed which are free of lead and molecular sieve. The coverings comprise: 100 parts by weight polyvinyl chloride, from 5 to 100 parts by weight of plasticizer, from 3 to 50 weight parts of calcined clay and a stabilizer system consisting essentially of at least two different organometal salts, and from 0.5 to 10 weight parts of finely divided hydrotalcite having the formulae: ¢(M12+)y1 (M22+)y2! 1-x M x3+(OH)2 Ax/nn- mH2O (I) or Mg 1-x Alx (OH)2 Ax/n n- mH2O (II) or Mg 1-x Alx (OH)2+x mH2O (III) wherein M1 2+ represents at least one divalent metal cation, M2 2+ represents at least one divalent metal cation, M3+ represents a trivalent metal cation, Anrepresents at least one anion having a valency of n and x, y1, y2 and m are represented by the following expressions 0 < x ? 0.5, 0 < y1, 0 < y2, 0.5 ? (y1+y2) < 1, and 0 ? m < 2; or a product resulting from surface treatment of I, II, or III with an anionic surface active agent.
申请公布号 CA2135467(A1) 申请公布日期 1995.06.04
申请号 CA19942135467 申请日期 1994.11.09
申请人 GEON COMPANY (THE) 发明人 BOO, H. KHIM;SMITH, GREGORY FRANCIS
分类号 C08K3/26;C08K3/34;C08K5/098;H01B3/44;(IPC1-7):H01B3/44;C08K13/02;C08L27/06;C08K5/09;C08K5/13;C08K3/18;C08K5/41 主分类号 C08K3/26
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