发明名称 Electrical connection structure with via hole, array substrate and display device
摘要 An electrical connection structure with a via hole, an array substrate and a display device are provided, and the electrical connection structure with the via hole includes: a first insulating layer disposed on a first electrical conductor and under a second electrical conductor and provided with a first via hole which overlaps the first electrical conductor and the second electrical conductor; and a conductive connection portion which passes through the first via hole, electrically connects the first electrical conductor to the second electrical conductor, and is electrically connected with at least one lateral surface of the first electrical conductor. The electrical connection structure with the via hole can solve the problem of a poor contact between the first electrical conductor and the conductive connection portion which is formed in the via hole.
申请公布号 US9530803(B2) 申请公布日期 2016.12.27
申请号 US201514906443 申请日期 2015.05.14
申请人 BOE TECHNOLOGY GROUP CO., LTD. 发明人 Xian Jianbo;Qiao Yong;Cheng Hongfei
分类号 H01L27/12;H01L23/522;H01L33/42 主分类号 H01L27/12
代理机构 Dilworth & Barrese, LLP. 代理人 Dilworth & Barrese, LLP.
主权项 1. An electrical connection structure with a via hole comprising: a first electrical conductor; a second electrical conductor; a first insulating layer, disposed on the first electrical conductor and under the second electrical conductor, wherein the first insulating layer is provided with a first via hole, and an overlapping region is provided between the first via hole and each of the first electrical conductor and the second electrical conductor; and a conductive connection portion, passing through the first via hole, wherein the first electrical conductor and the second electrical conductor are electrically connected through the conductive connection portion, and the conductive connection portion is electrically connected with at least one lateral surface of the first electrical conductor.
地址 Beijing CN