发明名称 Pass through mode for multi-chip-module die
摘要 A multi-chip-module (MCM) architecture allows direct access to a chip with minimum cost in space, yield, and signal delay. A first chip of the MCM is connected to a second chip via corresponding I/Os, but only the first chip has I/Os are directly accessible off the MCM. A coupling circuit, responsive to a control signal, which passes signals in the directly accessible I/Os of the first chip to the I/Os of the second chip.
申请公布号 US5625631(A) 申请公布日期 1997.04.29
申请号 US19960638414 申请日期 1996.04.26
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 ZIMMERMAN, JEFFREY S.;ROHRBAUGH, III, GEORGE W.
分类号 G01R31/26;G01R31/28;G01R31/3185;G06F11/22;(IPC1-7):G06F11/00 主分类号 G01R31/26
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