发明名称 |
Pass through mode for multi-chip-module die |
摘要 |
A multi-chip-module (MCM) architecture allows direct access to a chip with minimum cost in space, yield, and signal delay. A first chip of the MCM is connected to a second chip via corresponding I/Os, but only the first chip has I/Os are directly accessible off the MCM. A coupling circuit, responsive to a control signal, which passes signals in the directly accessible I/Os of the first chip to the I/Os of the second chip.
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申请公布号 |
US5625631(A) |
申请公布日期 |
1997.04.29 |
申请号 |
US19960638414 |
申请日期 |
1996.04.26 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ZIMMERMAN, JEFFREY S.;ROHRBAUGH, III, GEORGE W. |
分类号 |
G01R31/26;G01R31/28;G01R31/3185;G06F11/22;(IPC1-7):G06F11/00 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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