发明名称 HEAT-RESISTANT RESIN COMPOSITION AND PRODUCTION OF ELECTRICALLY INSULATED ELECTRIC AND ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To obtain the subject composition useful for electric and electronic parts, capable of providing a cured resistance suitable for moistureproof electrical insulation, etc., excellent in heat resistance and flame-retardance, by including a specific hydride, a polyisocyanate, hydrated alumina and a phosphoric acid ester. SOLUTION: This composition comprises (A) an OH group-containing liquid hydrogenated polyisoprene, (B) a polyisocyanate, (C) hydrated alumina and (D) a phosphoric acid ester. The component A having 500-10,000 number-average molecular weight and about 0.6-1.5meq/g OH group content is used and about 0.7-1.5 equivalent of tolylene diisocyanate based on OH group of the component A is used as the component B. Preferably 1-20wt.% of the component C having 0.1-100μm particle diameter is used and about 1-20wt.% of tricresyl phosphate is used as the component D.
申请公布号 JPH10251505(A) 申请公布日期 1998.09.22
申请号 JP19970057319 申请日期 1997.03.12
申请人 HITACHI CHEM CO LTD 发明人 OBARA MASAKATSU;OMORI EIJI;SHIGA SATOSHI;OKAWARA TOSHIICHI
分类号 C08K3/22;C08G18/69;C08K5/521;C08L15/00;C08L75/04;(IPC1-7):C08L75/04 主分类号 C08K3/22
代理机构 代理人
主权项
地址