| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device producing abrasive excellent in dispersion stability and removability from abraded surface and capable of obtaining the polished surface apart from flaws, dishing and residual particles by including a diketone compound and hydrogen peroxide together with vinyl compound polymer resin particles. SOLUTION: This abrasive, in the form of an aqueous emulsion, for applying a chemically mechanical polishing to a metal surface (e.g. copper-based metal) deposited on a silicone wafer, comprises; (A) vinyl compound polymer resin particles (having an average particle size of e.g. 0.05 to 0.5μm) resulted from emulsion polymerization, (B) aβ-diketone compound e.g. acetyl acetone and (C) hydrogen peroxide. The abrasive pref. comprises 0.5 to 20 wt.% of component A, 0.01 to 20 wt.% of component B and 0.05 to 10 wt.% of component C.
|
