| 摘要 |
The invention concerns a novel type of encapsulated surface wave components and a collective method for making such components. The component comprises a wave surface device at the substrate surface; the encapsulating case includes, besides the substrate, a first layer located on the substrate and locally hollowed at least at the surface wave device active surface, a printed circuit covering the whole of the first layer and conductive via holes running through the first layer/printed circuit assembly so as to ensure the electrical connection of the surface wave device from outside. |
