| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device wherein a semiconductor chip having a larger electrode face than traditional one is mounted without changing the size of a package, and which can be utilized for large electric power which needs low forward voltage and high withstand voltage. <P>SOLUTION: The surface-mounting semiconductor device is provided with external electrodes 8 on the bottom and upper surfaces of square ends. In the conventional semiconductor chip 5 to be mounted, its electrode face uses the square bottom and upper surfaces. However, this semiconductor chip 5 having a larger electrode face can be mounted by mounting the semiconductor chip 5 while allowing its electrode face to face the square side face. As a result, it can be utilized for large electric power to use its reduced forward voltage and high withstand voltage. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
