发明名称 |
PACKAGE ON PACKAGE (POP) DEVICE COMPRISING SOLDER CONNECTIONS BETWEEN INTEGRATED CIRCUIT DEVICE PACKAGES |
摘要 |
Some features pertain to a package on package (PoP) device that includes a first package, a first solder interconnect coupled to the first integrated circuit package, and a second package coupled to the first package through the first solder interconnect. The second package includes a first die, a package interconnect comprising a first pad, where the first solder interconnect is coupled to the first pad of the package interconnect. The second package also includes a redistribution portion coupled to the first die and the package interconnect, an encapsulation layer at least partially encapsulating the first die and the package interconnect. The first pad may include a surface that has low roughness. The encapsulation layer may encapsulate the package interconnect such that the encapsulation layer encapsulates at least a portion of the first solder interconnect. |
申请公布号 |
WO2016172633(A1) |
申请公布日期 |
2016.10.27 |
申请号 |
WO2016US29055 |
申请日期 |
2016.04.22 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
KESER, Lizabeth, Ann;RAE, David, Fraser |
分类号 |
H01L23/00;H01L21/56;H01L23/498;H01L25/00;H01L25/10 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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