发明名称 MAKING MULTILAYER 3D CAPACITORS USING ARRAYS OF UPSTANDING RODS OR RIDGES
摘要 In one embodiment, a method for making a 3D Metal-Insulator-Metal (MIM) capacitor includes providing a substrate having a surface, forming an array of upstanding rods or ridges on the surface, depositing a first layer of an electroconductor on the surface and the array of rods or ridges, coating the first electroconductive layer with a layer of a dielectric, and depositing a second layer of an electroconductor on the dielectric layer. In some embodiments, the array of rods or ridges can be made of a photoresist material, and in others, can comprise bonded wires.
申请公布号 US2016322456(A1) 申请公布日期 2016.11.03
申请号 US201615207837 申请日期 2016.07.12
申请人 Invensas Corporation 发明人 WANG Liang;KATKAR Rajesh;SHEN Hong;UZOH Cyprian Emeka
分类号 H01L49/02 主分类号 H01L49/02
代理机构 代理人
主权项 1. A method for making a capacitor, the method comprising: providing a substrate having a surface; forming at least one upstanding rod or ridge on the surface; depositing a first layer of an electroconductor on the surface and on the at least one rod or ridge; coating the first electroconductive layer with a layer of a dielectric; and depositing a second layer of an electroconductor on the dielectric layer.
地址 San Jose CA US