发明名称 MULTILAYER WIRING STRUCTURAL BODY
摘要 PROBLEM TO BE SOLVED: To provide a multilayer wiring structural body capable of suppressing lateral shift and falling of a bump composed of a material containing a resin.SOLUTION: A multilayer wiring structural body according to an embodiment may comprise: a multilayer wiring structure laminated with a plurality of wirings; a structural body arranged above the multilayer wiring structure; and a bump having an opening in which at least a part of the structural body is arranged therein, including a resin, and electrically connected to one of the plurality of wiring layers.SELECTED DRAWING: Figure 3a
申请公布号 JP2016184619(A) 申请公布日期 2016.10.20
申请号 JP20150063316 申请日期 2015.03.25
申请人 DAINIPPON PRINTING CO LTD 发明人 TAKANO TAKAMASA;KUDO HIROSHI
分类号 H05K3/34;H01L21/60;H05K3/46 主分类号 H05K3/34
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