发明名称 |
MULTILAYER WIRING STRUCTURAL BODY |
摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring structural body capable of suppressing lateral shift and falling of a bump composed of a material containing a resin.SOLUTION: A multilayer wiring structural body according to an embodiment may comprise: a multilayer wiring structure laminated with a plurality of wirings; a structural body arranged above the multilayer wiring structure; and a bump having an opening in which at least a part of the structural body is arranged therein, including a resin, and electrically connected to one of the plurality of wiring layers.SELECTED DRAWING: Figure 3a |
申请公布号 |
JP2016184619(A) |
申请公布日期 |
2016.10.20 |
申请号 |
JP20150063316 |
申请日期 |
2015.03.25 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
TAKANO TAKAMASA;KUDO HIROSHI |
分类号 |
H05K3/34;H01L21/60;H05K3/46 |
主分类号 |
H05K3/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|