发明名称 Halogen-free resin composition, and prepreg and laminate for printed circuits using same
摘要 Halogen-free resin composition, prepreg, and laminate for printed circuits. Based on 100 parts by weight of organic solid matter, it comprises: (A) dicyclopentadiene-type benzoxazine resin: 50-80 parts by weight; (B) dicyclopentadiene-type epoxy resin; (C) dicyclopentadiene-type novolac hardener; (D) phosphorus-containing flame retardant. The dicyclopentadiene structure in (A) decreases the dielectric constant, dielectric dissipation value, and water absorption of cured products and maintain adhesive force as the main resin; adding (B) can improve the tenacity of cured products and maintain low water absorption and excellent dielectric performances; Taking the dicyclopentadiene-type novolac as the hardener can sufficiently exert the advantage of excellent dielectric performances and good thermal and moisture resistance resulted from the dicyclopentadiene-containing structure. The prepreg above and the laminate for printed circuits using the prepreg have low dielectric constant, low dielectric dissipation factor, low water absorption, high adhesion, high thermal resistance and good flame retardancy, processability and chemical resistance.
申请公布号 US9487652(B2) 申请公布日期 2016.11.08
申请号 US201414552775 申请日期 2014.11.25
申请人 Shengyi Technology Co., Ltd. 发明人 You Jiang
分类号 B32B27/38;B32B27/04;B32B27/18;B32B27/20;B32B27/26;C08L63/04;C08G59/24;C08G59/32;C08G59/62;C08K3/36;C08K5/49;C08L39/04;C08L63/00 主分类号 B32B27/38
代理机构 Workman Nydegger 代理人 Workman Nydegger
主权项 1. A halogen-free resin composition, comprising: 100 parts by weight of an organic solids component and a positive amount of up to 50 parts by weight of at least one filler (F), said organic solids component comprising (A), (B), (C), and (D): (A) 52-80 parts by weight, based on 100 total parts by weight of the organic solids component, of a dicyclopentadiene-type benzoxazine resin having a chemical structure as follows: in which, X is selected from —H, —CH3, —C2H5, and —C(CH3)3,n1 is 0 or 1, andR is an alkyl or an aryl; (B) a dicyclopentadiene-type epoxy resin having a chemical structure as follows: in which, Y is selected from —H, —CH3, —C2H5, and —C(CH3)3, andn2 is any integer in 0-7; (C) a dicyclopentadiene-type novolac hardener having a chemical structure as follows: in which, Z is selected from —H, —CH3, —C2H5, and —C(CH3)3, andn3 is any integer in 0-7; and (D) 5-50 parts by weight, based on 100 total parts by weight of (A), (B), and (C), of at least one phosphorus-containing flame retardant; wherein the at least one filler (F) is other than the at least one phosphorus-containing flame retardant (D).
地址 Guangdong CN