| 发明名称 |
MOUNTING BOARD MODULE |
| 摘要 |
A mounting board module includes a board; a circuit unit disposed on a first side of the board; and a power supply unit disposed a second side of the board, opposite the first and configured to supply power to the circuit unit, wherein the board comprises a ground layer disposed between the circuit unit and the power supply unit, wherein the ground layer is configured to be electrically grounded. |
| 申请公布号 |
US2016302303(A1) |
申请公布日期 |
2016.10.13 |
| 申请号 |
US201615075732 |
申请日期 |
2016.03.21 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM Min Hoon;JIN Se Min;CHANG Jae Hyun |
| 分类号 |
H05K1/02;H05K1/18 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A mounting board module comprising:
a board; a circuit unit disposed on a first side of the board; and a power supply unit disposed a second side of the board, opposite the first and configured to supply power to the circuit unit, wherein the board comprises a ground layer disposed between the circuit unit and the power supply unit, wherein the ground layer is configured to be electrically grounded. |
| 地址 |
Suwon-si KR |
