发明名称 |
Surface Mounted Box for Integrated Circuit Micromodule |
摘要 |
The box is made into an enclosure by combining a micromodule (M) with protruding connectors (6) formed as contact zones flush w.r.t. each other onto a semiconductor substrate (S) which has corresponding contact areas (5) and tracks. The tracks cover the substrate surface and have end holes for surface mounted pins to be connected to the substrate. |
申请公布号 |
FR2734984(A1) |
申请公布日期 |
1996.12.06 |
申请号 |
FR19950013487 |
申请日期 |
1995.11.14 |
申请人 |
SGS THOMSON MICROELECTRONICS SA |
发明人 |
STEFFEN FRANCIS |
分类号 |
G06K19/077;H01L23/24;H01L23/31;H01L23/498;H05K3/30;H05K3/34 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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