| 摘要 |
PROBLEM TO BE SOLVED: To lighten thermal stress to be generated in a second terminal and to prevent damage by sealing a wiring board having a first terminal having the same thermal expansion coefficient as a main wiring board and to be connected to a single or a plurality of electrodes and an external connecting second terminal to be connected to it. SOLUTION: The circuit surface 21A of a bare chip 21 mounts a wiring board 22 made of an organic board the same as a main wiring board a size smaller than that surface. Along with joining each internal connecting terminal 26 provided on the terminal surface 22A of the wiring board 22 to the corresponding pad of the bare chip 21 with a wire 27, a solder ball 29 is provided on the upper end surface of an external connecting terminal 28 provided corresponding to each of these internal connecting terminal 26, and the bare chip 21 and the wiring board 22 are sealed into a body with insulating resin 23. As a result of this, it becomes possible to lighten stress concentration to be generated in the external connecting terminal 28 owing to the difference of the thermal expansion coefficients. |
