发明名称 |
Method and apparatus for thermally treating objects |
摘要 |
The invention relates to a method and to a device for thermally treating objects. The aim of the invention is to facilitate a better control of the temperature profile of an object to be thermally treated. To this end, the invention provides a method and a device for thermally treating an object in a heating system, especially for treating semiconductor wafers (2) in a rapid heating system (1). The objects are thermally treated at a predetermined temperature progression and the temperature of the object is controlled via a PID control and a feedforward control that are based on a simulation model of the heating system and the object. Said model consists of individual models of components of the heating system and/or the object. The parameters of at least one of the individual models are monitored during the thermal treatment and the model is adapted to the monitored parameters.
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申请公布号 |
US6775471(B2) |
申请公布日期 |
2004.08.10 |
申请号 |
US20030332119 |
申请日期 |
2003.03.05 |
申请人 |
MATTSON THERMAL PRODUCTS GMBH |
发明人 |
BLERSCH WERNER;URBAN JOCHEN;PAUL SILKE;RUBY UWE;HAUF MARKUS |
分类号 |
H01L21/26;G05D23/19;G05D23/27;(IPC1-7):F26B3/30 |
主分类号 |
H01L21/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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